GKG Series High Precision Automatic Solder Paste Printer designed for high precision
steel mesh printing or stencil printing in SMT industry.
Printing PCB size:50mm x 50mm ~510mm x 510mm;
PCB thickness: 0.4mm ~ 14mm
FPC thickness: ≦0.6mm (Excluding jig)
Applicable pitches of Components
SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications;
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3mm; support BGA, CSP packaging,
min. ball 0.2mm;
Applicable PCB Types
Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics,
medical power equipment, aerospace and aviation, besides general electronics products.
1,All new 3rd generation stencil X beam structure, add solder paste operators more convenient and accurate placement steel net;
New type torque X beam, solve the solder paste and dust deposition, prolong the service life of the machine;
2,Scalable on pressure device, in view of easy deformation of the PCB printing can make the tablet out, don't need to use pressure
for a little while can back again. According to the product flexible use
3,The whole machine use imported self-lubricating guide rail, guide rail need not add lubricant, within five years guide free maintenance within five years.
4,X Y1 Y2 in U.S. HAYDON linear motor, the Japanese precision drive screw, self-lubricating guide rail, to ensure accuracy
5,Net frame Y to automatically locate, can quickly realize automatic stencil counterpoint;
6,Curved blade beam using high strength steel, in the printing process to ensure the stability of the print head;
Floating type scraper system, the unique elastic stay device, can very good protection in scraper drop process stencil and scraper.
Item | Parameter | |
Repeat Position Accuracy | ±0.01mm(Test data and method are available) | |
Printing Accuracy | ±0.025mm(Test data and method are available) | |
Printing Speed / Cycle Time | <8s (Exclude Printing & Cleaning) | |
Products Changeover | <5Min | |
Screen Stencil Size/Min-Max | 470mm X370mm-737mm X737mm | |
Screen Stencil Size/Thickness | 20mm ~ 40mm | |
PCB Size/Min-Max/Thickness | 50X50mm-510X510mm/0.4~15mm | |
PCB Warpage Ratio | <1%(Based on diagonal length) | |
Bottom of Board Size | 15mm(Standard configuration), 25mm | |
Edge of Board Size | 3mm | |
Conveyor Height | 900±40mm | |
Conveyor Direction | Left-Right; Right-Left; Left-Left; Right-Right | |
Conveyor Speed | 100-1500mm/sec Programmable control | |
Board Positioning | Support System | Magnetic pin/Side support block/Flexible automatic pin(optional) |
Clamping System | Elastic side clamping/Vacuum nozzle/Extension-type Z-direction table setting | |
Print head | Two indepandent Motorised printheads | |
Squeegee Speed | 6~300mm/sec | |
Squeegee Pressure | 0-10kg software control(closed-loop pressure feedback), pressure value visible | |
Squeegee Angle | 60°(Standard )/55°/45° | |
Squeegee Type | Steel squeegee (standard), rubber squeegee, and other types of squeegee shall be customized. | |
Steel Mesh Separation Speed | 0.1~20mm/sec Programmable Control | |
Cleaning Method | Dry-type, wet-type, vacuum-type ( Programmable combination of Cleaning methods) | |
Table Adjustment Range | X/Y:±20mm;θ:±2° | |
Type of Fiducial Point | Standard geometry shape of fiducial point, bonding pad / Stencil hole | |
Camera System | Single digital camera for upward/downward vision system | |
Air Pressure | 4~6Kg/cm2 | |
Air Consumption | Approx 0.07m3 /min | |
Control Method | PC Control | |
Power Supply | AC:220±10%,50/60HZ 1Φ 1.5KW | |
Machine Dimensions/Weight | Depends on exactly model | |
Operation Temperature | -20°C ~ +45°C | |
Operation Humidity | 30%~60% |