Reflow ovens are used in Surface Mount Technology (SMT) manufacturing or semiconductor packaging processes. Typically, reflow ovens are part of an electronics assembly line, including printing and placement machines. The printing machine prints solder paste on the PCB, and the placement machine places components on the printed solder paste.
Setting Up a Reflow Solder Pot
Setting up a reflow oven requires knowledge of the solder paste used in the assembly. Does the slurry require a nitrogen (low oxygen) environment during heating? Reflow specifications, including peak temperature, time above liquidus (TAL), etc.? Once these process characteristics are known, the process engineer can work to set up the reflow oven recipe with the goal of achieving a certain reflow profile. A reflow oven recipe refers to the oven temperature settings, including zone temperatures, convection rates, and gas flow rates. The reflow profile is the temperature that the board “sees” during the reflow process. There are many factors to consider when developing a reflow process. How big is the circuit board? Are there any very small components on the board that could be damaged by high convection? What is the maximum component temperature limit? Is there a problem with rapid temperature growth rates? What is the desired profile shape?
Features and Features of Reflow Oven
Many reflow ovens have automatic recipe setup software that allows the reflow solder to create a starting recipe based on board characteristics and solder paste specifications. Analyze reflow soldering by using a thermal recorder or trailing thermocouple wire. Reflow setpoints can be adjusted up/down based on actual thermal profile vs. solder paste specifications and board/component temperature constraints. Without an automatic recipe setup, engineers can use the default reflow profile and adjust the recipe to focus the process through analysis.
Post time: Apr-17-2023