SMD introduction
SMT patch refers to the abbreviation of a series of process processes processed on the basis of PCB. PCB (Printed Circuit Board) is a printed circuit board.
SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation for Surface Mounted Technology), which is the most popular technology and process in the electronics assembly industry.
Electronic circuit surface assembly technology (Surface Mount Technology, SMT), known as surface mount or surface mount technology. It is a kind of non-pin or short-lead surface mount components (SMC/SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through Circuit assembly and connection technology that is soldered and assembled by methods such as reflow soldering or dip soldering.
Under normal circumstances, the electronic products we use are designed by PCB plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so all kinds of electrical appliances need a variety of SMT chip processing technology to process, Its function is to leak solder paste or patch glue onto the pads of the PCB to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine), which is located at the forefront of the SMT production line.
Basic process of SMT
1. Printing (silk printing): Its function is to print solder paste or patch adhesive onto the pads of the PCB to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine), which is located at the forefront of the SMT production line.
2. Glue dispensing: It is to drop glue onto the fixed position of the PCB board, and its main function is to fix the components to the PCB board. The equipment used is a glue dispenser, which is located at the forefront of the SMT production line or behind the testing equipment.
3. Mounting: Its function is to accurately install the surface mount components to the fixed position of the PCB. The equipment used is a placement machine, which is located behind the screen printing machine in the SMT production line.
4. Curing: Its function is to melt the patch adhesive, so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a curing oven, which is located behind the placement machine in the SMT production line.
5. Reflow soldering: Its function is to melt the solder paste, so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven/wave soldering, located behind the placement machine in the SMT production line.
6. Cleaning: Its function is to remove the welding residues harmful to human body such as flux on the assembled PCB board. The equipment used is a washing machine, and the location may not be fixed, online or offline.
7. Inspection: Its function is to inspect the welding quality and assembly quality of the assembled PCB board. The equipment used includes magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The location can be configured in a suitable place on the production line according to the needs of detection.
The SMT process can greatly improve the production efficiency and accuracy of printed circuit boards, and truly realize the automation and mass production of PCBA.
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Post time: Mar-08-2023