PriceList for wave solder - Yamaha High-efficiency Modular YSM20R pick and place machine – Chengyuan

1-Head Solution

Two types of heads are available that bring the “1-head solution” to an even higher dimension capable of accommodating a wide range of components while maintaining high speed with no head replacement. High-speed general-purpose heads can be used for ultra-small (0201mm) chip components. 

Odd-shaped components (FM : Flexible Multi) head

Super wide-ranging type head supports load control, and handles a broad spectrum of components from ultra-tiny chips of 03015mm,to ultra-large components of 55 x 100 mm and tall components of heights to 28 mm.

Superb mounting performance 95,000 CPH (under optimum conditions as defined by Yamaha Motor)

Improving mounter operation from component pickup to mounting and using high-speed XY axes achieved production of 95,000 CPH which is 5% higher than conventional models.

Huge improved adaptability to actual production

Mounting a new type wide-scan camera increases and expands recognition capability to support high speed mounting of components down to only □8 mm to □12 mm in size. Also, use of side lighting gives high-speed recognition of ball electrode components such as CSP (chip scale packages) and BGA (ball grid arrays).

Beam variations available in 2 types

Achieving a common platform allows selecting from 1-beam and 2-beam for configuring the X-axis according to production mode and mounting capability.

Detects pickup status and component’s presenge with no downtime loss.

Specifications: